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Прибави към ЛЮБИМИ СТОКИ!Type
CPU / Microprocessor
Market segment
Desktop
Family
AMD Phenom II X6
Model number ?
1045T
CPU part number
HDT45TWFK6DGR is an OEM/tray microprocessor
Stepping codes
ACBBE CB CCBBE CB
Frequency (MHz) ?
2700
Turbo frequency (MHz)
3200 (3 cores or less)
Bus speed (MHz) ?
667 MHz Memory controller
One 2000 MHz 16-bit HyperTransport link
Clock multiplier ?
13.5
Package
938-pin organic micro-PGA
Socket
Socket AM3
Weight
1.4oz / 38.3g
Introduction date
August - September, 2010
Architecture / Microarchitecture
Microarchitecture
K10
Platform
Leo
Processor core ?
Thuban
Core stepping ?
PH-E0
CPUID
100FA0
Manufacturing process
0.045 micron SOI
Die size
346mm2
Data width
64 bit
Number of cores
6
Floating Point Unit
Integrated
Level 1 cache size ?
6 x 64 KB instruction caches6 x 64 KB data caches
Level 2 cache size ?
6 x 512 KB caches
Level 3 cache size
6 MB shared cache
Cache latency
3 (L1 cache)13 (L2 cache)47 (L3 cache)
Multiprocessing
Uniprocessor
Features
MMX
3DNow!
SSE
SSE2
SSE3
SSE4a ?
Advanced Bit Manipulation ?
AMD64 technology ?
AMD-V (virtualization) technology
Enhanced Virus Protection ?
Turbo Core technology
Low power features
Cool'n'Quiet 3.0
On-chip peripherals
Integrated DDR2/DDR3 Memory Controller
HyperTransport 3.x technology
Electrical/Thermal parameters
V core (V) ?
1.075 - 1.375 (at rated frequency)1.225 - 1.425 (Turbo Core mode)0.975 - 1.175 (Minimum performance state)
V NorthBridge (V)
1.05 - 1.175
Maximum operating temperature (°C) ?
55 - 71
Thermal Design Power (W) ?
95
Notes on AMD HDT45TWFK6DGR
On socket AM2+/AM3 platforms in the minimum performance state the processor runs at 800 MHz core voltage and has TDP 47.1 Watt
Пълно описание:
Type
CPU / Microprocessor
Market segment
Desktop
Family
AMD Phenom II X6
Model number ?
1045T
CPU part number
HDT45TWFK6DGR is an OEM/tray microprocessor
Stepping codes
ACBBE CB CCBBE CB
Frequency (MHz) ?
2700
Turbo frequency (MHz)
3200 (3 cores or less)
Bus speed (MHz) ?
667 MHz Memory controller
One 2000 MHz 16-bit HyperTransport link
Clock multiplier ?
13.5
Package
938-pin organic micro-PGA
Socket
Socket AM3
Weight
1.4oz / 38.3g
Introduction date
August - September, 2010
Architecture / Microarchitecture
Microarchitecture
K10
Platform
Leo
Processor core ?
Thuban
Core stepping ?
PH-E0
CPUID
100FA0
Manufacturing process
0.045 micron SOI
Die size
346mm2
Data width
64 bit
Number of cores
6
Floating Point Unit
Integrated
Level 1 cache size ?
6 x 64 KB instruction caches6 x 64 KB data caches
Level 2 cache size ?
6 x 512 KB caches
Level 3 cache size
6 MB shared cache
Cache latency
3 (L1 cache)13 (L2 cache)47 (L3 cache)
Multiprocessing
Uniprocessor
Features
MMX
3DNow!
SSE
SSE2
SSE3
SSE4a ?
Advanced Bit Manipulation ?
AMD64 technology ?
AMD-V (virtualization) technology
Enhanced Virus Protection ?
Turbo Core technology
Low power features
Cool'n'Quiet 3.0
On-chip peripherals
Integrated DDR2/DDR3 Memory Controller
HyperTransport 3.x technology
Electrical/Thermal parameters
V core (V) ?
1.075 - 1.375 (at rated frequency)1.225 - 1.425 (Turbo Core mode)0.975 - 1.175 (Minimum performance state)
V NorthBridge (V)
1.05 - 1.175
Maximum operating temperature (°C) ?
55 - 71
Thermal Design Power (W) ?
95
Notes on AMD HDT45TWFK6DGR
On socket AM2+/AM3 platforms in the minimum performance state the processor runs at 800 MHz core voltage and has TDP 47.1 Watt
Производител: http://www.amd.com
Цена: 190.89 USD
| ЕТИКЕТИ amd, cpu, processors |
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